Lead Solder Paste

◆ Excellent printability, eliminate the omission, sag and caking phenomenon in the process of printing.

◆ Good wettability ,bright spot, full, evenly.

◆ Generated solder beads rarely when reflowed ,effectively improve the occurrence of short circuit.

◆ After the printing on the PCB still can maintain its viscosity for a long time

◆ Suitable for different reflow machine, different temperature curves.