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List of electronics package dimensions
This is a list of integrated circuit packaging and other electronics package form factors.
Contents

Dimension reference

Surface-mount

A general surface mount chip, with major dimensions.
 C  Clearance between IC body and PCB
 H  Total Height
 T  Lead Thickness
 L  Total Carrier Length 
 LW Lead Width
 LL Lead Length
 P  Pitch
 WB IC Body Width
 WL Lead-to-Lead Width

Through hole

A general through hole pin chip, with major dimensions.
 C  Clearance between IC body and board
 H  Total Height
 T  Lead Thickness
 L  Total Carrier Length 
 LW Lead Width
 LL Lead Length
 P  Pitch
 WB IC Body Width
 WL Lead-to-Lead Width-

Package dimensions

All measurements below are given in mm. To convert mm to mil, divide mm by 0.0254 (i.e. 2.54 mm / 0.0254 = 100 mill).

C - Clearance between package body and PCB.
H - Height of package from pin tip to top of package.
T - Thickness of pin.
L - Length of package body only.
LW - Pin width.
LL - Pin length from package to pin tip.
P - Pin pitch (distance between conductors to the PCB).
WB - Width of the package body only.
WL - Length from pin tip to pin tip on the opposite side.

Dual row

Image Family Pin Name Package WB WL H C L P LL T LW
Three IC circuit chips.JPG DIP Y Dual Inline Package 8-DIP 6.2-6.48 7.62 7.7   9.2-9.8 2.54 (1/10 inch) 3.05-3.6   1.14-1.73
32-DIP   15.24       2.54 (1/10 inch)      
  LFCSP N Lead Frame Chip Scale Package             0.5      
MSOP-sized chip package.jpg MSOP Y Mini Small Outline Package 8-MSOP 3 4.9 1.1 0.15 3 0.65   0.23 0.38
MFrey SOIC20.jpg SO
SOIC
SOP
Y Small Outline Integrated Circuit 8-SOIC 3.9 5.8-6.2 1.72 0.10-0.25 4.8-5.0 1.27 1.05 0.19-0.25 0.39-0.46
14-SOIC 3.9 5.8-6.2 1.72 0.10-0.25 8.55-8.75 1.27 1.05 0.19-0.25 0.39-0.46
16-SOIC 3.9 5.8-6.2 1.72 0.10-0.25 9.9-10 1.27 1.05 0.19-0.25 0.39-0.46
16-SOIC 7.5 10.00-10.65 2.65 0.10-0.30 10.1-10.5 1.27 1.4 0.23-0.32 0.38-0.40
SOT23-6.jpg SOT Y Small Outline Transistor SOT-23-8 1.6 2.8 1.45   2.9 0.65 0.6   0.22-0.38
  SSOP Y Shrink Small-Outline Package                    
  TDFN  ? Thin Dual Flat No-lead 8-TDFN 3 3 0.7-0.8   3 0.65 N/A   0.19-0.3
  TSOP Y Thin Small-Outline Package                    
TSSOP EXP PAD 16L.gif TSSOP Y Thin Shrink Small Outline Package 8-TSSOP 4.4 6.4 1.2 0.15 3 0.65   0.09-0.2 0.19-0.3
  µSOP Y Micro Small Outline Package             0.5      

Quad rows

Image Family Pin Name Package WB WL H C L P LL T LW
  CLCC N Ceramic Leadless Chip Carrier 48-CLCC 14.22 14.22 2.21   14.22 1.016 N/A   0.508
Cyrix cx9210 gfdl.jpg LQFP Y Low-profile Quad Flat Package                    
PIC18F8720.jpg TQFP Y Thin Quad Flat Pack TQFP-44 10.00 12.00   0.35-0.50   0.80 1.00 0.09-0.20 0.30-0.45
  TQFN N Thin Quad Flat No-lead
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