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C Clearance between IC body and PCB H Total Height T Lead Thickness L Total Carrier Length LW Lead Width LL Lead Length P Pitch WB IC Body Width WL Lead-to-Lead Width |
C Clearance between IC body and board H Total Height T Lead Thickness L Total Carrier Length LW Lead Width LL Lead Length P Pitch WB IC Body Width WL Lead-to-Lead Width- |
All measurements below are given in mm. To convert mm to mil, divide mm by 0.0254 (i.e. 2.54 mm / 0.0254 = 100 mill).
C - Clearance between package body and PCB.
H - Height of package from pin tip to top of package.
T - Thickness of pin.
L - Length of package body only.
LW - Pin width.
LL - Pin length from package to pin tip.
P - Pin pitch (distance between conductors to the PCB).
WB - Width of the package body only.
WL - Length from pin tip to pin tip on the opposite side.
Image | Family | Pin | Name | Package | WB | WL | H | C | L | P | LL | T | LW |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DIP | Y | Dual Inline Package | 8-DIP | 6.2-6.48 | 7.62 | 7.7 | 9.2-9.8 | 2.54 (1/10 inch) | 3.05-3.6 | 1.14-1.73 | |||
32-DIP | 15.24 | 2.54 (1/10 inch) | |||||||||||
LFCSP | N | Lead Frame Chip Scale Package | 0.5 | ||||||||||
MSOP | Y | Mini Small Outline Package | 8-MSOP | 3 | 4.9 | 1.1 | 0.15 | 3 | 0.65 | 0.23 | 0.38 | ||
SO SOIC SOP |
Y | Small Outline Integrated Circuit | 8-SOIC | 3.9 | 5.8-6.2 | 1.72 | 0.10-0.25 | 4.8-5.0 | 1.27 | 1.05 | 0.19-0.25 | 0.39-0.46 | |
14-SOIC | 3.9 | 5.8-6.2 | 1.72 | 0.10-0.25 | 8.55-8.75 | 1.27 | 1.05 | 0.19-0.25 | 0.39-0.46 | ||||
16-SOIC | 3.9 | 5.8-6.2 | 1.72 | 0.10-0.25 | 9.9-10 | 1.27 | 1.05 | 0.19-0.25 | 0.39-0.46 | ||||
16-SOIC | 7.5 | 10.00-10.65 | 2.65 | 0.10-0.30 | 10.1-10.5 | 1.27 | 1.4 | 0.23-0.32 | 0.38-0.40 | ||||
SOT | Y | Small Outline Transistor | SOT-23-8 | 1.6 | 2.8 | 1.45 | 2.9 | 0.65 | 0.6 | 0.22-0.38 | |||
SSOP | Y | Shrink Small-Outline Package | |||||||||||
TDFN | ? | Thin Dual Flat No-lead | 8-TDFN | 3 | 3 | 0.7-0.8 | 3 | 0.65 | N/A | 0.19-0.3 | |||
TSOP | Y | Thin Small-Outline Package | |||||||||||
TSSOP | Y | Thin Shrink Small Outline Package | 8-TSSOP | 4.4 | 6.4 | 1.2 | 0.15 | 3 | 0.65 | 0.09-0.2 | 0.19-0.3 | ||
µSOP | Y | Micro Small Outline Package | 0.5 |
Image | Family | Pin | Name | Package | WB | WL | H | C | L | P | LL | T | LW |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CLCC | N | Ceramic Leadless Chip Carrier | 48-CLCC | 14.22 | 14.22 | 2.21 | 14.22 | 1.016 | N/A | 0.508 | |||
LQFP | Y | Low-profile Quad Flat Package | |||||||||||
TQFP | Y | Thin Quad Flat Pack | TQFP-44 | 10.00 | 12.00 | 0.35-0.50 | 0.80 | 1.00 | 0.09-0.20 | 0.30-0.45 | |||
TQFN | N | Thin Quad Flat No-lead |